đąăEXCELLENT THERMAL CONDUCTIVITYă: Upgraded thermal silica gel material with 12.8 W/mK thermal conductivity, Density (G/cc): 3.1±0.2 Hardness (Sc): 30~55; Breakdown voltage: 9.8KV; Conductivity: None, our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
âĄăSUPER RELIABLE & DURABLE ă: High temperature performance in -40 â - 200 â will not melt, non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldnât result in damage of any sort.
đȘăEASY & CONVENIENT TO USE ă: the thermal pads can be cut freely according to your needs, perfect to filled contact surfaces gap, a great assistant for both beginners and professionals.
â ăWIDELY APPLICATIONă: Perfectly replaces traditional heatsink compound grease paste, great for PC, Control board, motor, electronics, CPU, GPU, Heat Sink, Power LED,PS4, auto mechanics, computer host, laptop, solid-state drives, Gaming equipment, DVD, VCD, LID, Set-top box, LED IC SMD DIP and any cooling modules.
đăNO RISK PURCHASE ă:We committed to provide superior thermal pads, easy to install, feel free to contact us if there is any issue with our thermal pads.